POSITIVE TYPE PHOTOSENSITIVE COMPOSITION USABLE FOR RECHARGING GAP FORMED BETWEEN SEMICONDUCTOR CHIP AND WAFER IN WAFER-LEVEL PACKAGE

摘要

PURPOSE: Provided is a positive type photosensitive composition usable as an underfill agent to recharge a gap formed between a semiconductor chip and a wafer in the wafer-level package and effective to cure the composition filled in the gap without exposure to light. CONSTITUTION: The positive type photosensitive composition comprises a compound having at least two epoxy groups in one molecule, a curing catalyst or a compound to form the curing catalyst by heat, and sulfonate. The sulfonate is at least one of compounds represented by the formulae 1 to 7. The composition can used for the production of a semiconductor device or a display device by coating the composition over a substrate then exposing the substrate to light; curing a part of the substrate not exposed by heating; and developing the exposed part.