发明名称 LGA PACKAGE SOCKET TO PREVENT DEFORMATION OF SOCKET HOUSING BY USING METALLIC COVER MEMBER AND REINFORCING PLATE
摘要 PURPOSE: An LGA(Land Grid Array) package socket is provided to prevent the deformation of a socket housing by using a metallic cover member and a reinforcing plate. CONSTITUTION: An LGA package socket(1) includes a rectangular insulating housing(2), a cover member(8) pivotally mounted on a first end side of the housing, and a lever(12) mounted on a second end side of the housing. When the cover member is closed, a free end of the cover member is locked with the lever. The LGA package socket further includes a reinforcing member(10) installed under the housing. The reinforcing member includes an interlocking part(14). The interlocking part is locked with the lever in a connection state of the lever and the cover member.
申请公布号 KR20040038752(A) 申请公布日期 2004.05.08
申请号 KR20030075530 申请日期 2003.10.28
申请人 TYCO ELECTRONICS AMP K.K. 发明人 SHIRAI HIROSHI;INOUE MASASHI;HASHIMOTO SHINICHI
分类号 H01R33/76;H01L23/32;H01L23/40;H05K7/10;(IPC1-7):H01L23/32 主分类号 H01R33/76
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