CARRIER HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A carrier head of a CMP(Chemical Mechanical Polishing) apparatus is provided to vary the pressure applied to the backside of a wafer according to a variety of needs under a polishing process and obtaining various profiles for wafers. CONSTITUTION: A carrier head of a CMP apparatus is provided with a carrier housing(10) for being driven by a carrier driving shaft, a holder housing(15) fixedly installed at the lower center portion of the carrier housing, and a membrane holder part(20) installed at the lower portion of the carrier housing for loading a ring type membrane(M) at its lower portion. At this time, the membrane holder part is capable of being moved up and down along the inner wall of the holder housing. The membrane defines a ring type chamber(62) capable of controlling inner pressure. At least one compensation chamber(63) is formed at the lower portion of the membrane holder for controlling the inner pressure. The compensation chamber is capable of dividing the ring type chamber into two chambers(62a,62b) when increasing its inner pressure.