| 摘要 |
PURPOSE: A vertical type electronic adhesive material and a method for manufacturing the same are provided, which is applied to a highly integrated semiconductor device with a fine pitch by vertically attaching the vertical type electronic adhesive material to the probe card. CONSTITUTION: A vertical type electronic adhesive material includes a main body part(10) and a plurality of tips(12). The main body part(10) is formed in the shape of column which is made of a conductive material. The plurality of tips(12) are formed on the bottom surface of the main body part(10). And, the plurality of tips(12) are made of a conductive material.
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