| 摘要 |
<p>Multi-layer circuit board is made by forming a through-hole in a resin film; filling the through-hole with conductive paste; drawing a circuit pattern on a resin film surface by injecting ink (20) including metal particles (21) from an ink injector; laminating resin films; and bonding the resin films together and sintering the circuit patterns and the conductive paste in the through-holes at the same time. Multi-layer circuit board is made by forming a through-hole in a resin film; filling the through-hole with conductive paste; drawing a circuit pattern on a resin film surface by injecting ink (20) including metal particles (21) from an ink injector; laminating resin films; and bonding the resin films together by pressing the films under heat, and sintering the circuit patterns and the conductive paste in the through-holes at the same time. An independent claim is also included for a multi-layer circuit board made by the inventive method.</p> |
