发明名称 |
Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process |
摘要 |
An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.
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申请公布号 |
US2004084511(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20030635825 |
申请日期 |
2003.08.06 |
申请人 |
TEST HOWARD R. |
发明人 |
TEST HOWARD R. |
分类号 |
C23C18/16;H01L21/288;H01L21/60;H01L23/485;(IPC1-7):B23K31/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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