| 发明名称 |
Finger metal-insulator-metal capacitor device with local interconnect |
| 摘要 |
The present invention includes a method of constructing a novel capacitor and geometry for the capacitor. The method and device include forming a multilayer structure having what generally can be described as a wave shape. Particular aspects of the present invention are described in the claims, specification and drawings.
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| 申请公布号 |
US2004084707(A1) |
申请公布日期 |
2004.05.06 |
| 申请号 |
US20030695167 |
申请日期 |
2003.10.28 |
| 申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
LIU LENVIS;HWANG CJ |
| 分类号 |
H01L27/04;H01L21/02;H01L21/822;(IPC1-7):H01L27/108;H01L29/76 |
主分类号 |
H01L27/04 |
| 代理机构 |
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