| 摘要 |
Provided for herein is a method of planarizing a printed circuit board substrate including contacting at least a portion of a printed circuit board substrate with a planarizing liquid, a planarizing surface, and an abrasive component that produces a surface texture on the planarized surface, the texture having a roughness less than the smallest wiring feature on the substrate, wherein the planarizing liquid includes a liquid carrier, and optionally components to remove material from the circuit board substrate and wherein the contacting comprises a plurality of contacting motions on the printed circuit board substrate.
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