发明名称 Z-axis packaging for electronic device and method for making same
摘要 A z-axis package for an electronic device and a method for making the z-axis packaging for the electronic device. The z-axis package is inexpensive to manufacture and can be assembled with automated surface mount equipment by the end user.
申请公布号 US2004084211(A1) 申请公布日期 2004.05.06
申请号 US20020284892 申请日期 2002.10.30
申请人 SENSONIX, INC. 发明人 FAYFIELD ROBERT T.
分类号 H01L23/498;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):H05K1/11 主分类号 H01L23/498
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