发明名称 |
Z-axis packaging for electronic device and method for making same |
摘要 |
A z-axis package for an electronic device and a method for making the z-axis packaging for the electronic device. The z-axis package is inexpensive to manufacture and can be assembled with automated surface mount equipment by the end user.
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申请公布号 |
US2004084211(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20020284892 |
申请日期 |
2002.10.30 |
申请人 |
SENSONIX, INC. |
发明人 |
FAYFIELD ROBERT T. |
分类号 |
H01L23/498;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):H05K1/11 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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