发明名称 |
Bonding pad metal layer geometry design |
摘要 |
A bonding pad suitable for use in wire bonding an integrated circuit includes an approximately rectangular metal pattern. The bonding pad has at least one slot or hole in it, located at or adjacent to at least one corner of the approximately rectangular metal pattern. The slot or hole provides peeling stress relief.
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申请公布号 |
US2004084779(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20020284715 |
申请日期 |
2002.10.31 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD. |
发明人 |
HUANG TAI-CHUN;LEE TZE-LIANG |
分类号 |
H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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