METHOD AND DEVICE FOR GRINDING DOUBLE SIDES OF THIN DISK WORK

摘要

A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2). The apparatus operates to bring the grinding faces (4a) into contact with the respective work surfaces (a) to advance each grinding face to the position of a predetermined depth of cut by moving at least one of the grinding wheels (4) while rotating the grinding wheels (4) and rotating the work (W) by the device (1) about an axis thereof as supported in a predetermined grinding position so that an outer periphery of the work (W) intersects outer peripheries of the grinding wheels (4) with a center (c) of the work (W) positioned inwardly of the grinding faces (4a), stop each of the grinding wheels (4) from advancing in the direction of depth of cut, move each of the grinding wheels (4) and the work (W) by the moving device (2) relative to each other in a direction parallel to the work surface (a) until the center (c) of the work (W) is positioned externally of the grinding faces (4a), and separate the grinding faces (4a) from the work surfaces (a). The surfaces of the work can be ground at the same time easily with diminished variations in the thickness of the work although the apparatus is small-sized.