| 摘要 |
Disclosed is a process for sealing component assembly to an electrical lighting device using induction healing. The assembly comprises the component, such as an electrode lead wire, and a solder glass perform. The process is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low-pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto without causing to damage other lamp components sensitive to high temperature. The present invention is particularly suitable for lamp envelopes made of borosilicate glass having a CTE form 0 to 300° C. in the range of 30-45x10<-7>° C<-1>.
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