发明名称 Polishing method and apparatus
摘要 A polishing tool such as a fixed abrasive polishing tool or a polishing pad is used in a polishing apparatus. A workpiece is pressed against a polishing surface of the polishing tool containing a resin to bring the workpiece into sliding contact with the polishing tool, thereby polishing the workpiece. The polishing surface of the polishing tool is kept at a temperature equal to or lower than a glass transition temperature of the polishing tool.
申请公布号 US2004087248(A1) 申请公布日期 2004.05.06
申请号 US20030616989 申请日期 2003.07.11
申请人 HIROKAWA KAZUTO 发明人 HIROKAWA KAZUTO
分类号 B24B55/02;B24B37/00;B24B37/015;B24B37/04;B24B49/14;B24B53/017;B24B53/02;B24D3/00;B24D3/28;B24D18/00;H01L21/304;(IPC1-7):B24B51/00 主分类号 B24B55/02
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