METHOD FOR PRODUCING A PACKAGED INTEGRATED CIRCUIT WITH A MICROCAVITY

摘要

There is described a method for producing a packaged integrated circuit. The method comprises a first step of building an integrated circuit having a mic ro- structure suspended above a micro-cavity, and having a heating element on th e micro-structure capable of heating itself and its immediate surroundings. A layer of protective material is then deposited on said micro-structure such that at least a top surface of the micro-structure and an opening of the mic ro- cavity is covered, wherein the protective material is in a solid state at ro om temperature and can protect the micro-structure during silicon wafer dicing procedures and subsequent packaging. The integrated circuit is packaged and an electric current is passed through the heating element such that a portion o f the protective material is removed and an unobstructed volume is provided above and below the micro-structure.