发明名称 |
Sealing lighting device component assembly with solder glass preform by using infrared radiation |
摘要 |
Disclosed is a method for sealing and affixing a component assembly for an electrical lighting device to a glass lamp envelope. The assembly used in the process comprises the component, such as an electrode lead wire and a solder glass perform. The process is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300° C. in the range of 30-45x10<-7>° C.<-1>.
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申请公布号 |
US2004083760(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20020284588 |
申请日期 |
2002.10.31 |
申请人 |
CANALE JOSEPH E.;COOCH STEPHEN L.;HAYNES WILLIAM L.;TUTTLE CLAYTON L. |
发明人 |
CANALE JOSEPH E.;COOCH STEPHEN L.;HAYNES WILLIAM L.;TUTTLE CLAYTON L. |
分类号 |
H01J9/26;H01J9/32;(IPC1-7):C03C27/00 |
主分类号 |
H01J9/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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