发明名称 Method for manufacturing laminated multilayer electronic components
摘要 [Object] To produce a laminated electronic part which has a superior surge-proofing property, a sufficient resistance to a flux, and good electrical properties, without occurring of structural effects such as cracking, delamination, or the like. [Solving Means] Conductive paste is prepared, which contains conductive particles and resin particles having a thermal decomposition-ability, the resin particles having an average particle size which is 0.25 to 1.50 times of the average particle size of the conductive particles, the resin particles being contained in an amount of which the volume ratio based on the amount of the conductive particles is in the range of 0.5 to 1.0. The conductive paste is applied to the surface of a ceramic layer to form a conductor layer. The ceramic layers and the conductor layers are alternately laminated. The laminate is fired to form a ceramic sintered laminate. Thus, a laminated electronic part is produced.
申请公布号 US2004084131(A1) 申请公布日期 2004.05.06
申请号 US20030448048 申请日期 2003.05.30
申请人 发明人 KONOUE MASAHURU;ANAO KIMIHARU
分类号 H01G4/232;C04B35/26;H01B1/22;H01F17/00;H01F41/04;H01G4/008;H01G4/012;H01G4/30;H05K1/09;(IPC1-7):C03B29/00 主分类号 H01G4/232
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