发明名称 BONDING OF SEMICONDUCTOR CHIPS IN CHIP CARDS
摘要 <p>A chip card having a chip card body, a semiconductor chip and a carrier substrate, the carrier substrate being provided on both sides with surface contacts and with contact-hole lines electrically connecting the upper and lower surface contacts to one another. The contact-hole lines are arranged so close to the edge of the carrier substrate that their lower ends open out into a base of an outer cavity, where they are closed off, to thereby prevent moisture from penetrating into the inner cavity, in which the semiconductor chip is located, without it being necessary to produce a dedicated cover for the contact-hole lines.</p>
申请公布号 EP1415271(A1) 申请公布日期 2004.05.06
申请号 EP20020754512 申请日期 2002.08.09
申请人 INFINEON TECHNOLOGIES AG 发明人 HEINEMANN, ERIK;PUESCHNER, FRANK
分类号 B42D15/10;G06K19/077;H01L23/498;(IPC1-7):G06K19/077;H01L23/31 主分类号 B42D15/10
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