| 发明名称 |
Forming a copper diffusion barrier |
| 摘要 |
Noble metal may be used as a non-oxidizing diffusion barrier to prevent diffusion from copper lines. A diffusion barrier may be formed of a noble metal formed over an adhesion promoting layer or by a noble metal cap over an oxidizable diffusion barrier. The copper lines may also be covered with a noble metal.
|
| 申请公布号 |
US2004084773(A1) |
申请公布日期 |
2004.05.06 |
| 申请号 |
US20020284576 |
申请日期 |
2002.10.31 |
| 申请人 |
JOHNSTON STEVEN W.;DUBIN VALERY M.;MCSWINEY MICHAEL L.;MOON PETER |
发明人 |
JOHNSTON STEVEN W.;DUBIN VALERY M.;MCSWINEY MICHAEL L.;MOON PETER |
| 分类号 |
H01L21/285;H01L21/288;H01L21/768;H01L23/532;(IPC1-7):H01L21/476;H01L23/48;H01L29/40 |
主分类号 |
H01L21/285 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
