发明名称 Method of manufacturing semiconductor device
摘要 In a semiconductor device having a semiconductor film crystallized by using a metal element, it is an object to provide a technique for reducing the crystal defects in a semiconductor film, and a technique for forming a semiconductor film with high crystallinity by effectively removing impurity metal elements. An amorphous semiconductor film is formed over a transparent substrate; the amorphous semiconductor film is crystallized by using metal elements; a crystalline semiconductor film is irradiated with a first laser beam in a direction from the semiconductor film to the substrate, thereby partly melted and crystallized; and the semiconductor film is irradiated with a second laser beam through the substrate in a direction from the substrate film to the semiconductor film.
申请公布号 US2004087156(A1) 申请公布日期 2004.05.06
申请号 US20030685380 申请日期 2003.10.16
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 MAEKAWA SHINJI
分类号 H01L21/302;H01L21/322;H01L21/336;H01L21/461;H01L21/768;H01L21/77;H01L21/84;H01L29/49;H01L29/786;(IPC1-7):H01L21/302 主分类号 H01L21/302
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