EXPANSION METHOD AND DEVICE

摘要

After a plate-like article (W) is subjected to a dicing process, an adhesive sheet (S) is expanded by expansion means (20) with the plate-like article (W) being mounted on a frame (F). As a result, the spacings between individual chips (T) are increased. The adhesive sheet (S) is maintained in the expanded state by expansion-maintaining means (10). The plate-like article (W), together with the frame (F), is thus made to be transportable with the spacings between the chips (T) being maintained, and therefore adjacent ones of the chips (T) are prevented from interfering with each other. The plate-like article (W) after a dicing process can be transported with the frame (F) without edge portions of adjacent ones of the chips (T) having breaks, micro-cracks, etc. resulted from contact between the edge portions caused by vibration during transportation.