发明名称 Magnetron sputtering system and photomask blank production method based on the same
摘要 The present invention provides a magnetron sputtering system, which ensures a formation of a desired thin film, using a thick target. In the sputtering process, a portion of the target does not have erosion free portions. The present invention provides a magnetron sputtering system comprising a chamber for sputtering, a target electrode 5 installed inside said chamber, a substrate electrode 6 installed in the chamber opposite to the target electrode, a ring-shaped magnet 2 installed so as to enclose the side surface of the target electrode, and a semi-circular disk shaped magnet installed opposite to the target-mounted surface of the target electrode, wherein the semi-circular disk shaped magnet is rotated in the circumferential direction of the target electrode and is magnetized in the direction perpendicular to the target electrode. This ensures a specific magnetic field component to be generated over the thick planar target surface 3. <IMAGE>
申请公布号 EP1221495(A3) 申请公布日期 2004.05.06
申请号 EP20010310413 申请日期 2001.12.13
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 WATANABE, MASATAKA;OKAZAKI, SATOSHI;KANEKO, HIDEO;OHASHI, KEN;KOBAYASHI, HIDEKI
分类号 C23C14/35;G03F1/50;G03F1/54;H01J37/34;H01L21/027;H01L21/203 主分类号 C23C14/35
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