发明名称 |
Electronic module, methods of manufacturing and driving the same, and electronic instrument |
摘要 |
An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
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申请公布号 |
US2004084740(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20030649902 |
申请日期 |
2003.08.28 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HAYASHI TAKAAKI |
分类号 |
H05B33/06;G09F9/00;G09G3/00;G09G3/10;G09G3/20;G09G3/30;H01L23/495;H01L31/0232;H01L51/50;H05B33/10;H05B33/14;H05B39/00;(IPC1-7):H01L31/023 |
主分类号 |
H05B33/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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