发明名称 Semiconductor device comprising buried channel region and method for manufacturing the same
摘要 A semiconductor device includes a gate insulating film formed on a semiconductor substrate between first diffusion layers, a gate electrode including a first gate portion formed on the gate insulating film and a second gate portion formed on the first gate portion, a first width in a channel direction of the first gate portion being substantially equal to a width in that of the gate insulating film, and a second width in the channel direction of the second gate portion being larger than the first width, a gate side wall insulating film including a first side wall portion formed on a side surface of the first gate portion and the gate insulating film and a second side wall portion formed on a side surface of the second gate portion, and a second diffusion layer formed apart from the first diffusion layers below the gate insulating film.
申请公布号 US2004084731(A1) 申请公布日期 2004.05.06
申请号 US20030602066 申请日期 2003.06.24
申请人 发明人 MATSUDA SATOSHI;AZUMA ATSUSHI
分类号 H01L21/266;H01L21/336;H01L29/10;H01L29/423;H01L29/78;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L21/266
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