发明名称 |
Method for forming a multi-frequency surface acoustic wave device |
摘要 |
Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
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申请公布号 |
US2004083590(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20020288529 |
申请日期 |
2002.11.05 |
申请人 |
CLARISAY, INC. |
发明人 |
LEE DAVID M.;LINDARS PAUL;JONES CHRISTOPHER ELLIS;FLOWERS JAMES E.;GOETZ MARTIN P. |
分类号 |
H03H3/08;H03H9/145;H05K3/04;(IPC1-7):H04R17/00;H01L41/08;H05K3/02 |
主分类号 |
H03H3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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