MICRO-STRUCTURE COOLING DEVICE AND USE THEREOF

摘要

The invention relates to a micro-structure cooling device (3) for an object (4) to be cooled, whereby the cooling device (3) includes a stack of at least two metal foils (1) and one base plate (5) that can be brought via a thermal contact surface (6) into thermal contact with the object (4), the metal foils (1) and the base plate (5) are joined to one another in a material fit, present in the metal foils (1) are channels (2) for cooling medium, and the channels (2) have a width in the range of from 100 to 2,000 µm, a depth in the range of from 25 to 1,000 µm and a mean interval in the range of from 50 to 1,000 µm, the residual foil thickness resulting from the channels (2) in the metal foils (1) are in the range of from 50 to 300 µm, and the base plate (5) has a thickness in the range of from 200 to 2,000 µm.