发明名称 ULTRASOUND PROBE WIRING METHOD AND APPARATUS
摘要 Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.
申请公布号 EP1414350(A1) 申请公布日期 2004.05.06
申请号 EP20020751558 申请日期 2002.07.26
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 MILLER, DAVID, G.
分类号 A61B8/12;H05K1/11;H05K1/14;H05K3/34;(IPC1-7):A61B8/12 主分类号 A61B8/12
代理机构 代理人
主权项
地址