发明名称 |
Circuit board and semiconductor device using the circuit board |
摘要 |
A semiconductor device comprises a metal base plate, an insulating substrate (1) placed on the metal base plate, a conductive foil (3) bonded to the insulating substrate with a bonding layer (2), and a semiconductor element mounted on the conductive foil. A marginal portion of the bonding layer spreads outside beyond the edges of the conductive foil. <IMAGE> |
申请公布号 |
EP0789397(B1) |
申请公布日期 |
2004.05.06 |
申请号 |
EP19970300625 |
申请日期 |
1997.01.30 |
申请人 |
HITACHI, LTD. |
发明人 |
TANAKA, AKIRA;KUSHIMA, TADAO;SHIMIZU, HIDEO;OKADA, SENSUKE;KOIKE, YOSHIHIKO;YAMADA, KAZUJI;SAITO, RYUICHI |
分类号 |
H01L23/13;H01L23/373;H01L23/498;H05K1/02;H05K1/03;H05K3/00;H05K3/38 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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