摘要 |
A wafer support device is provided including a fixed base, a guiding device on the fixed base, a movable base disposed movably vertically with respect to the fixed base by the cross roller guide, and a first pressing device fixed on the fixed base. The first pressing device presses the movable base. A wafer support device is also provided which a theta stage rotatably disposed on the movable base with the vertical direction as a rotation axis, a linear motor fixed on the fixed base, a contact bar disposed on the movable base, a load control device controlling a load of pressing, and a controller controlling a pressing force by the pressing device based on the load detected by the load sensor. The first pressing device has a cylinder which is fixed on the fixed base and has a main pressurizing chamber and a sub-pressurizing chamber, a piston rod vertically moving in the main pressurizing chamber and the sub-pressurizing chamber, respectively, a main pressure controller controlling a pressure in the main pressurizing chamber, and a sub pressure controller controlling a pressure in the sub-pressurizing chamber.
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