发明名称 Wafer support device and a wafer support method
摘要 A wafer support device is provided including a fixed base, a guiding device on the fixed base, a movable base disposed movably vertically with respect to the fixed base by the cross roller guide, and a first pressing device fixed on the fixed base. The first pressing device presses the movable base. A wafer support device is also provided which a theta stage rotatably disposed on the movable base with the vertical direction as a rotation axis, a linear motor fixed on the fixed base, a contact bar disposed on the movable base, a load control device controlling a load of pressing, and a controller controlling a pressing force by the pressing device based on the load detected by the load sensor. The first pressing device has a cylinder which is fixed on the fixed base and has a main pressurizing chamber and a sub-pressurizing chamber, a piston rod vertically moving in the main pressurizing chamber and the sub-pressurizing chamber, respectively, a main pressure controller controlling a pressure in the main pressurizing chamber, and a sub pressure controller controlling a pressure in the sub-pressurizing chamber.
申请公布号 US2004084824(A1) 申请公布日期 2004.05.06
申请号 US20030694841 申请日期 2003.10.29
申请人 NEC CORPORATION 发明人 OGATSU TOSHINOBU
分类号 H01L21/66;B23Q1/48;B23Q16/02;B23Q17/00;H01L21/00;(IPC1-7):B23Q3/18 主分类号 H01L21/66
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