| 发明名称 |
USING SONIC ENERGY IN CONNECTION WITH LASER-ASSISTED DIRECT IMPRINTING |
| 摘要 |
A laser-assisted direct imprint process enables direct transfer of patterns on a contact mold to molten semiconductor material. During the pattern transfer, sonic energy may be applied to improve the efficacy of the pattern transfer.
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| 申请公布号 |
US2004087186(A1) |
申请公布日期 |
2004.05.06 |
| 申请号 |
US20020273474 |
申请日期 |
2002.10.18 |
| 申请人 |
BRASK JUSTIN K. |
发明人 |
BRASK JUSTIN K. |
| 分类号 |
H01L21/268;H01L21/768;(IPC1-7):H01L21/477;H01L21/26;H01L21/324;H01L21/42;H01L21/44 |
主分类号 |
H01L21/268 |
| 代理机构 |
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