STACKABLE LIQUID COOLING PUMP

摘要

Electronic system components are cooled using a field configurable pump comprising a selectable plurality of identical or nearly identical modular pump units. The pump units are disposed in a stacked arrangement and are fluidly connected to adjacent modular pump units via a removable coupling, preferably one of the quick-disconnect variety. Each modular pump unit comprises a housing, an impeller and a sealing mechanism. When disposed in a stack the combined pump structure is driven by a single motor. In this fashion, pump structures may be employed which are adaptable to heat flux demands imposed by the electronic components.