发明名称 Method for forming thin-film, apparatus for forming thin-film, method for manufacturing semiconductor device, electro-optical unit, and electronic apparatus
摘要 [Object] To provide a method for forming a high-performance thin-film at low cost using a liquid material in safety, an apparatus for forming a thin-film, a method for manufacturing a semiconductor device, an electro-optical unit, and an electronic apparatus. [Solving Means] An apparatus for forming a thin-film includes a coating unit 21 for applying a liquid material containing a thin-film component onto a substrate and also includes heat-treating units 22, 23, and 24 for heating the substrate applied with the liquid material. The coating unit 21 and the heat-treating units 22, 23, and 24 each include a control means for controlling the atmosphere in a treating chamber for treating the substrate.
申请公布号 US2004087068(A1) 申请公布日期 2004.05.06
申请号 US20030419123 申请日期 2003.04.21
申请人 SEIKO EPSON CORPORATION 发明人 YUDASAKA ICHIO
分类号 H05B33/10;C23C18/16;H01L21/00;H01L21/02;H01L21/20;H01L21/208;H01L21/288;H01L21/31;H01L21/316;H01L21/336;H01L21/768;H01L21/77;H01L21/84;H01L27/12;H01L27/32;H01L29/786;H01L51/50;(IPC1-7):H01L21/84 主分类号 H05B33/10
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