发明名称 |
Semiconductor light emitting element formed on a clear or translucent substrate |
摘要 |
This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side. |
申请公布号 |
US6730530(B2) |
申请公布日期 |
2004.05.04 |
申请号 |
US20020303461 |
申请日期 |
2002.11.25 |
申请人 |
LUMINARY LOGIC LTD |
发明人 |
FUWAUSA MICHELLE JILLIAN;DOWHOWER KEVIE |
分类号 |
G04B19/30;H01L25/075;H01L33/62;(IPC1-7):H01L21/00 |
主分类号 |
G04B19/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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