| 摘要 |
A method of forming wiring, comprising the steps of forming a metal film on a substrate having recessed parts or opening parts in the surface thereof, applying metal particulate diffusion liquid on the metal film with steps, evaporating solvent contained in the metal particulate diffusion liquid to form a metal particulate film, and removing, by polishing, the metal film excluding the portions thereof in the recessed parts or the opening parts and the metal particulate film, whereby the steps on the metal film can be effectively relieved, and the cut of the metal film in the recessed parts or the opening parts can be reduced. |
