| 发明名称 |
Methods for multiple die stack apparatus employing t-shaped interposer elements |
| 摘要 |
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed.
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| 申请公布号 |
US6730543(B2) |
申请公布日期 |
2004.05.04 |
| 申请号 |
US20010989341 |
申请日期 |
2001.11.20 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM SALMAN |
| 分类号 |
H01L25/065;(IPC1-7):H01L21/48;H01L21/50;H01L21/44 |
主分类号 |
H01L25/065 |
| 代理机构 |
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