发明名称 Methods for forming wordlines, transistor gates, and conductive interconnects, and wordline, transistor gate, and conductive interconnect structures
摘要 The invention encompasses stacked semiconductor devices including gate stacks, wordlines, PROMs, conductive interconnecting lines, and methods for forming such structures. The invention also includes a method of forming a transistor gate comprising: a) forming gate dielectric layer; b) forming a polysilicon gate layer against the gate dielectric layer; and c) doping the polysilicon gate layer with a conductivity-enhancing dopant, the dopant being provided in a concentration gradient within the polysilicon layer, the concentration gradient increasing in a direction toward the gate dielectric layer. The invention also includes a wordline comprising: a) a polysilicon line; a substantially fluorine impervious barrier layer over the polysilicon line; and a b) layer of metal-silicide over the substantially fluorine impervious barrier layer.
申请公布号 US6730584(B2) 申请公布日期 2004.05.04
申请号 US19990333770 申请日期 1999.06.15
申请人 MICRON TECHNOLOGY, INC. 发明人 SCHUEGRAF KLAUS FLORIAN;POWELL CARL;THAKUR RANDHIR P. S.
分类号 H01L21/28;H01L29/49;(IPC1-7):H01L21/22;H01L21/44 主分类号 H01L21/28
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