Folded-flex bondwire-less multichip power package

摘要

A multichip wirebond-less integrated circuit and power die package is based on a folded single-layer flex circuit. The package is formed with metal-studbumped power dies and IC's flipchiped to a patterned flex substrate. Extensions of the flex substrate are folded and attached to the backside of the dies for electrical and/or thermal contact. I/O pins are along the periphery of the package for standard SMT mounting while heatspreaders are attached to both sides of the package for double-sided cooling.