发明名称 Focused ion beam process for removal of copper
摘要 A process for milling copper metal from a substrate having an exposed copper surface includes absorbing a halogen gas onto the exposed copper surface to generate reaction products of copper and the halogen gas; removing unreacted halogen gas from the surface; and directing a focused ion beam onto the surface to selectively remove a portion of the surface comprising the reaction products.
申请公布号 US6730237(B2) 申请公布日期 2004.05.04
申请号 US20010887791 申请日期 2001.06.22
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SIEVERS MICHAEL R.;HERSCHBEIN STEVEN B.;SHORE AARON D.
分类号 C23F4/00;H01L21/3213;(IPC1-7):C23F1/00;C23C14/34 主分类号 C23F4/00
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