发明名称 |
Focused ion beam process for removal of copper |
摘要 |
A process for milling copper metal from a substrate having an exposed copper surface includes absorbing a halogen gas onto the exposed copper surface to generate reaction products of copper and the halogen gas; removing unreacted halogen gas from the surface; and directing a focused ion beam onto the surface to selectively remove a portion of the surface comprising the reaction products.
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申请公布号 |
US6730237(B2) |
申请公布日期 |
2004.05.04 |
申请号 |
US20010887791 |
申请日期 |
2001.06.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SIEVERS MICHAEL R.;HERSCHBEIN STEVEN B.;SHORE AARON D. |
分类号 |
C23F4/00;H01L21/3213;(IPC1-7):C23F1/00;C23C14/34 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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