| 发明名称 |
Semiconductor device package |
| 摘要 |
A semiconductor package that includes two circuit boards and at least one semiconductor device which is disposed between the two circuit boards and connected to external connectors disposed on at least one of the circuit boards. |
| 申请公布号 |
AU2003277266(A8) |
申请公布日期 |
2004.05.04 |
| 申请号 |
AU20030277266 |
申请日期 |
2003.10.02 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
MARTIN STANDING |
| 分类号 |
H01L23/538;H01L25/07 |
主分类号 |
H01L23/538 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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