METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING PROVISIONAL AND PERMANENT SUBSTRATES

摘要

PURPOSE: A method of manufacturing a semiconductor device is provided to simplify manufacturing processes and to reduce fabrication cost by separating previously chips from each other using a provisional substrate. CONSTITUTION: A semiconductor device structure is formed on a selected provisional substrate(100,120). The structure of the semiconductor device is divided into a plurality of discrete units by using a physical or chemical method(130). The plurality of discrete units are attached on a selected permanent substrate(140). The provisional substrate is removed from the discrete units(150).