发明名称 APPARATUS FOR LOADING SEMICONDUCTOR PACKAGE INTO TUBE
摘要 PURPOSE: An apparatus for loading a semiconductor package into a tube is provided to simplify a structure and perform a complete separation process by making the first package picker pick up the semiconductor packages singulated from a singulation part and transfer the semiconductor package into the first guide region of a guide block or by making the second package picker put down a good semiconductor package in the second guide region and transfer a defective semiconductor package into a defective product loading unit. CONSTITUTION: The first guide region receives a row of semiconductor packages(2) at a time when they are all good products. The second guide region sequentially receives only the good product one by one when at least one of the row of the semiconductor packages is defective. The guide block moves by the operation of an air cylinder, including the first and second guide regions. A pusher(320) pushes the semiconductor packages in the first and second guide regions of the guide block toward a good product chute. The good product loading unit(300) includes the guide block and the pusher. The good product chute receives the semiconductor package pushed by the pusher, functioning as a guide when the semiconductor package is transferred to a tube by a package transfer carrier.
申请公布号 KR20040036840(A) 申请公布日期 2004.05.03
申请号 KR20020065512 申请日期 2002.10.25
申请人 HANMISEMICONDUCTOR CO., LTD. 发明人 YANG, HAE CHUN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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