| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide semiconductor element mounting equipment which is capable of sufficiently improving the reliability of an electrical connection by restraining voids from being produced in a joint when a semiconductor element is fixed onto a circuit board. <P>SOLUTION: The semiconductor element mounting equipment is equipped with an element contact unit 12 which is arranged on the top surface of the semiconductor element 8 as it is confronted with the top surface, and a pressure generating member 14 which is moved in a vertical direction as it is fixing the element contact part 12. The element contact unit 12 is formed of an elastic material and has such a shape wherein the part of the contact unit 12 confronted with the one end 8a of the semiconductor element 8 is thick (thickness a), the contact unit 12 gets gradually smaller in thickness towards the other end 8b, and the part of the contact unit 12 confronted with other end 8b is set the smallest in thickness (thickness b:b<a). When the pressure generating member is made to descend by a prescribed distance, the thick part of the element contact unit 12 is pressed against the one end 8a. Moreover, if the pressure generating member 14 is made to descend by a prescribed distance, the element contact unit 12 is eleastically deformed to increase the area in contact with the semiconductor element, and the area pressing the element contact unit 12 gradually expands toward the other end side. <P>COPYRIGHT: (C)2004,JPO |
