发明名称 MANUFACTURING METHOD OF P-TYPE GROUP III NITRIDE COMPOUND SEMICONDUCTOR
摘要 <P>PROBLEM TO BE SOLVED: To reduce resistivity in a p-type group III nitride-based compound semiconductor layer. <P>SOLUTION: On a first group III nitride-based compound semiconductor layer, where p-type impurities are added, a second group III nitride-based compound semiconductor layer, where no impurities are added or n-type impurities or n- and p-type impurities are added, is formed. Resistance-lowering treatment is conducted by heat treatment, during or after the formation of the second group III nitride-based compound semiconductor layer. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004134750(A) 申请公布日期 2004.04.30
申请号 JP20030279732 申请日期 2003.07.25
申请人 TOYODA GOSEI CO LTD 发明人 TAKI TETSUYA
分类号 H01L21/20;H01L21/205;H01L21/225;H01L21/263;H01L21/324;H01L33/06;H01L33/32;H01S5/323 主分类号 H01L21/20
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