| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a small non-contact IC card on which a semiconductor device with a narrow gap between electrode terminals can be mounted, even without forming a wiring pattern on the rear side of a formation face of a planar coil made of an insulated resin thin film body. <P>SOLUTION: This method comprises a process for forming a planar coil 52 on one face of an insulated resin thin film body 54, and a process for piercing respective through holes 14a and 14b for exposing both terminal parts 52a of the planar coil 52 to the other face side of the insulated resin thin film body 54, and respective through holes 14c and 14d for exposing both electrode terminals 58 of the semiconductor device 56 to the other face side of the insulated resin thin film body 54. Furthermore, the method comprises a process for sticking the semiconductor device 56 to the one face of the insulated resin thin film body 54 so that a bump 16 of the electrode terminals 58 can be located in the third and fourth through holes 14c and 14d, a process for applying conductive paste to the other face of the insulated resin thin film body 54 to connect the terminal parts 52a of the planar coil 52 and the electrode terminals 58 of the semiconductor device 56, a process for drying the conductive paste, and a process for attaching an oversheet 62 made of resin to the thin film body from both sides of the insulated thin film body 54. <P>COPYRIGHT: (C)2004,JPO |
