MULTILAYERED WIRING BOARD, MATERIAL FOR IT, AND METHOD OF MANUFACTURING IT

摘要

PROBLEM TO BE SOLVED: To obtain a multilayered wiring board that shows high ion migration resistance, contains a multilayered connecting electric circuit having low electrical resistance, and is excellent in electrical characteristic. SOLUTION: A conductive section composed of a conductive resin packed in a via hole 14 is constituted in a double structure of a first conductive section 15 composed of a conductive resin covering the inner peripheral surface of the hole 14 and containing a conductive filler other than silver, and a second conductive section 16 composed of a conductive resin filling up the inside of the first conductive section 15 and containing a conductive filler composed mainly of silver. COPYRIGHT: (C)2004,JPO