| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an Ni plating coat, which method prevents voids and cracks from arising in the Ni plating coat even if the Ni plating coat formed as a base coat for solder bumps is subjected to repetitive thermal cycling. SOLUTION: In depositing the Ni plating coat 3 which is the base coat for the solder bumps 4, only the Ni plating liquid controlled in the concentration of impurity component to≤10 [ppm] (to 1 [ppm] when the impurity component is Pb) is used as the Ni plating liquid. COPYRIGHT: (C)2004,JPO |
