| 摘要 |
PROBLEM TO BE SOLVED: To improve the peeling resistance of an organic film of a resin film from an inorganic film such as a metal film. SOLUTION: This semiconductor device for a micromachine is used for the micromachine and comprises a semiconductor substrate 1, an organic film 4 for locking, the inorganic film 2, and the organic film 3. The organic film 4 for locking is formed in a recess 1a formed in a surface of the semiconductor substrate 1. The inorganic layer 2 is formed on the surface at the opposite side of the semiconductor substrate 1 of the organic film 4 for locking and has a through part 2a which the organic film 4 for locking cannot pass. The organic film 3 is provided on the surface of the inorganic film 2 with the inorganic film 2 interposed between the organic film 4 for locking and itself, and is integrally formed with the organic film 4 for locking through the through part 2a. COPYRIGHT: (C)2004,JPO
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