发明名称 METHOD AND DEVICE FOR BREAKING BRITTLE MATERIAL SUBSTRATE, AND PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To suppress the formation of an irregular form in a disruption face at the time of breaking a brittle substrate, and to prevent the formation of a crack in a laminated substrate when the brittle substrate is broken. SOLUTION: A rubber plate 22 and a stainless plate 23 are provided on a table 21. A glass substrate 24 to be broken, having a scribe line, is arranged on their upper part. Stoppers 25 each having a height nearly equal to the glass substrate 24 are arranged at both sides of the glass substrate 24, and according to the scribe line, pressing is carried out with a breaking bar 27 from upper part. By this method, the deformation of the disruption face can be inhibited because the deformation state of the glass substrate 24 is reflected on the rubber plate 22 and the stainless plate 23. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004131341(A) 申请公布日期 2004.04.30
申请号 JP20020298424 申请日期 2002.10.11
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MAEKAWA KAZUYA;NONAKA KAZUYUKI
分类号 B26F3/04;B26F3/00;C03B33/03;C03B33/033;C03B33/037;C03B33/07;C03B33/09;(IPC1-7):C03B33/03 主分类号 B26F3/04
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