发明名称 ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS PRODUCING METHOD, AND COPPER CLAD LAMINATED BOARD USING ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
摘要 <P>PROBLEM TO BE SOLVED: To provide a product and a producing method with which the separating strength of a carrier foil is further stabilized after press-working an electrolytic copper foil with the carrier foil using organic agent on a joined boundary layer. <P>SOLUTION: In the electrolytic copper foil with the carrier foil provided with the joint boundary layer 2 at the one side surface of the carrier foil C and provided with the electrolytic copper foil layer CF on this joint boundary layer 2, the layer 2 is formed by using solution containing carboxybenzotriazole and the polymer of methylbenzotriazole and MBTA polymer contained in layer 2 is 2.0-60.0wt%. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004131836(A) 申请公布日期 2004.04.30
申请号 JP20020352058 申请日期 2002.12.04
申请人 MITSUI MINING & SMELTING CO LTD 发明人 KOMODA YASUO;ONO TOSHIAKI;NOGUCHI HIDEAKI;TAGUCHI TAKEO;SUDO TATSUYA
分类号 H05K1/09;C25D1/04;C25D1/22;C25D7/06 主分类号 H05K1/09
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