发明名称 |
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS PRODUCING METHOD, AND COPPER CLAD LAMINATED BOARD USING ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a product and a producing method with which the separating strength of a carrier foil is further stabilized after press-working an electrolytic copper foil with the carrier foil using organic agent on a joined boundary layer. <P>SOLUTION: In the electrolytic copper foil with the carrier foil provided with the joint boundary layer 2 at the one side surface of the carrier foil C and provided with the electrolytic copper foil layer CF on this joint boundary layer 2, the layer 2 is formed by using solution containing carboxybenzotriazole and the polymer of methylbenzotriazole and MBTA polymer contained in layer 2 is 2.0-60.0wt%. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004131836(A) |
申请公布日期 |
2004.04.30 |
申请号 |
JP20020352058 |
申请日期 |
2002.12.04 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
KOMODA YASUO;ONO TOSHIAKI;NOGUCHI HIDEAKI;TAGUCHI TAKEO;SUDO TATSUYA |
分类号 |
H05K1/09;C25D1/04;C25D1/22;C25D7/06 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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