SUBSTRATE TREATMENT METHOD, HEATING TREATMENT APPARATUS, AND PATTERN FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To suppress an acid from sticking again onto a resist film in PEB (post exposure bake) treatment. SOLUTION: The substrate treatment method includes a step for forming a chemically amplified resist film on a substrate, a step for irradiating the chemically amplified resist film with energy rays to form a latent image, and a step for applying heating treatment to the chemically amplified resist film. The heating treatment is performed while relatively moving a heating part for heating the chemically amplified resist film and the substrate, by forming an air current which flows backwards in the relative moving direction of the heating part between a lower surface of the heating part and the chemically amplified resist film. COPYRIGHT: (C)2004,JPO