| 摘要 |
PROBLEM TO BE SOLVED: To provide a developing device for manufacturing a semiconductor, which can efficiently apply a developing solution to a standstill substrate over a wide range at a low pressure by placing the solution on the substrate. SOLUTION: This developing device for manufacturing a semiconductor, which discharges the developing solution to the surface of the substrate 15, is provided with a nozzle pipeline 13 which supplies the developing solution, and a tapered spoon-like nozzle 14 which discharges the developing solution to the surface of the substrate 16 upon receiving the solution from the pipeline 13. This device can put the solution on the substrate 15 with an arbitrary spraying angle at a low fixed pressure by using the nozzle 14. COPYRIGHT: (C)2004,JPO |
